An special dissemination event was organized during the Paris Air Show (SIAE 2023) at Le Bourget, on the SAFRAN stand.

A presentation of the COMAP-4S project was communicated by representatives of the Consortium, constituted by Safran Electronics & Defense, NanoXplore, ACB, and TUB (*).

During this conference, the audience present on the stand was able to learn about the ambitious objectives of “Advanced Packaging and High Integration Electronic” developed in the project for critical embedded applications.

Through this presentation, the added value of System-in-Package was firstly discussed for the FPGA core use case in Space applications. Then the different technological bricks were described, showing the maturity levels achieved and the progress on-going for HDI PCBs, for SLP substrates and Flip-Chip assemblies, and for thermal management solutions.

(*): Eric Bridot & Jean-Claude Fabre from Safran Electronics & Defense – Edouard Lepape from NanoXplore – Joachim Verhegge from ACB